InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem

InPsytech Showcases 3nm UCIe 3.0 Technology

InPsytech, a subsidiary of Egis Technology, will participate in the Open Compute Project (OCP) Global Summit 2025 in San Jose, California.

The company will showcase its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard, 3D packaging integration, and ultra-high-speed, low-power performance.

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Author's summary: InPsytech showcases 3nm UCIe 3.0 tech at OCP 2025.

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Design And Reuse Design And Reuse — 2025-10-14